Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/026688
Kind Code:
A1
Abstract:
Provided are: a resin composition having exceptional heat resistance over an extended period of time, especially an exceptional retention rate of impact strength and retention rate of nominal tensile strain; and a molded article. Also provided is a resin composition that scarcely changes color tone even when placed under high temperature for an extended period of time while satisfying these retention rates. A resin composition containing 0.01-1.0 part by mass of a solubilizing agent, 0.01-1.0 part by mass of a phenolic antioxidant represented by formula (1), 0.01-1.0 part by mass of a phosphorus antioxidant, and 0.01-1.0 part by mass of an amine antioxidant per 100 parts by mass of a resin component comprising 10-60 parts by mass of polyphenylene ether resin and 90-40 parts by mass of polyamide resin, the mass ratio of phenolic antioxidant represented by formula (1)/phosphorus antioxidant/amine antioxidant in the resin composition being 1/0.1-2.0/0.1-2.0.
Inventors:
YANAGISAWA KENICHI (JP)
Application Number:
PCT/JP2018/027686
Publication Date:
February 07, 2019
Filing Date:
July 24, 2018
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08L77/00; C08K3/26; C08K5/18; C08K5/20; C08K13/02; C08L71/12
Domestic Patent References:
WO2001094471A1 | 2001-12-13 |
Foreign References:
JPH0726136A | 1995-01-27 | |||
CN103194014A | 2013-07-10 | |||
JPS6015453A | 1985-01-26 | |||
JPH0726136A | 1995-01-27 | |||
JP2005344065A | 2005-12-15 | |||
JP2012179911A | 2012-09-20 |
Other References:
See also references of EP 3663360A4
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE AND DOWNLOAD PROCESSING METHOD
Next Patent: RESIN COMPOSITION, MOLDED ARTICLE, AND ELECTRICAL WIRE
Next Patent: RESIN COMPOSITION, MOLDED ARTICLE, AND ELECTRICAL WIRE