RESIN COMPOSITION AND MOLDED ARTICLE

WIPO Patent Application WO/2023/032408

A1

The present invention provides: a resin composition that makes it possible to provide a molded article which can maintain high strength and in which an increase in YI value is suppressed, even after a long period of irradiation with ultraviolet light; and a molded article that is formed from the resin composition. Provided is a resin composition comprising a polyamide resin and a triazine-based ultraviolet absorber, wherein: the polyamide resin contains a xylylenediamine-based polyamide resin which contains a constituent unit derived from a diamine and a constituent unit derived from dicarboxylic acid, in which not less than 70 mol% of the constituent unit derived from the diamine is derived from xylylenediamine, and in which not less than 70 mol% of the constituent unit derived from the dicarboxylic acid is derived from a C6-14 α,ω-linear aliphatic dicarboxylic acid; the triazine-based ultraviolet absorber exhibits an absorbance of not less than 0.50 for the wavelength of 290 nm when in the form of a 10 mg/L chloroform solution; and the content of the triazine-based ultraviolet absorber is not less than 0.5 mass% of the total mass of the resin composition.

YAMANAKA MASAKI (JP)
ODA TAKAFUMI (JP)

PCT/JP2022/023901

March 09, 2023

June 15, 2022

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MITSUBISHI GAS CHEMICAL CO (JP)

C08L77/06; C08G69/26; C08K5/3492; D01F6/60; D01F6/84

WO2017010390A1	2017-01-19
WO2020159085A1	2020-08-06
WO2017010389A1	2017-01-19
WO2020250564A1	2020-12-17

JP2018087319A	2018-06-07
JP2020200405A	2020-12-17
JP2015196835A	2015-11-09
JP2003192798A	2003-07-09
JP2000300131A	2000-10-31
JP2019089905A	2019-06-13
JP2019089905A	2019-06-13
JP4894982B1	2012-03-14
JP2010281027A	2010-12-16
JP2016223037A	2016-12-28
JP2020200405A	2020-12-17

SIKS & CO. (JP)

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