Title:
RESIN COMPOSITION, AND MOLDED PRODUCT AND FILM USING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/085249
Kind Code:
A1
Abstract:
Provided is a resin composition that can provide a film and the like capable of suppressing coloring even after being heated. The present invention also provides a molded product, a film, an electrically conductive film, a film capacitor, a polarization material, an electrostatic induction type conversion element, and a touch panel, in all of which the resin composition is used. This resin composition contains: a copolymer (A) including a structural unit (a1) derived from 1,1-dicyanoethylene and a structural unit (a2) derived from a compound represented by general formula (I); and a Brønsted acidic compound (B). The resin composition is characterized in that the contained amount of the Brønsted acidic compound (B) in the resin composition is 0.1-95,000 mass ppm.
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Inventors:
IISHIBA KAZUKI (JP)
INATOMI ATSUSHI (JP)
INATOMI ATSUSHI (JP)
Application Number:
PCT/JP2023/038030
Publication Date:
April 25, 2024
Filing Date:
October 20, 2023
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L35/04; C08F222/34; H01B5/14; H01G4/32; H01G7/02
Domestic Patent References:
| WO2023224053A1 | 2023-11-23 | |||
| WO2023224054A1 | 2023-11-23 |
Foreign References:
| JP2021059620A | 2021-04-15 | |||
| JPS59155406A | 1984-09-04 | |||
| JPS63271253A | 1988-11-09 | |||
| JPH01103614A | 1989-04-20 | |||
| JPH01302329A | 1989-12-06 | |||
| JPH0384010A | 1991-04-09 | |||
| US5057588A | 1991-10-15 | |||
| US3243415A | 1966-03-29 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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