Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188401
Kind Code:
A1
Abstract:
This resin composition for molding comprises a curable resin and an inorganic filler, wherein the inorganic filler includes calcium titanate particles and at least either of silica particles or alumina particles; the content ratio of the calcium titanate particles is 10% by volume or more and less than 30% by volume based on the total amount of the inorganic filler; and the content ratio of the total amount of the inorganic filler exceeds 60% by volume based on the total amount of the resin composition for molding.
Inventors:
YAMAURA MASASHI (JP)
Application Number:
PCT/JP2022/016913
Publication Date:
October 05, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L23/29; C08K3/22; C08K3/24; C08K3/36; C08L63/00; C08L101/00; H01K1/40; H01L23/31
Domestic Patent References:
| WO2019131095A1 | 2019-07-04 | |||
| WO2019111298A1 | 2019-06-13 |
Foreign References:
| JP6870778B1 | 2021-05-12 | |||
| JP2020122115A | 2020-08-13 | |||
| JP2017528530A | 2017-09-28 | |||
| JP2004363065A | 2004-12-24 | |||
| JP2004035858A | 2004-02-05 | |||
| JPH09320025A | 1997-12-12 | |||
| CN107141721A | 2017-09-08 | |||
| JP2004006316A | 2004-01-08 |
Other References:
ZHANG LI-YUAN; XU MAN; LI WEN-DONG; LIU ZHE; ZHANG GUAN-JUN: "Fabrication and characterization of BaTiO3/Al2O3/epoxy composites with tunable dielectric permittivity", 2016 IEEE INTERNATIONAL CONFERENCE ON HIGH VOLTAGE ENGINEERING AND APPLICATION (ICHVE), IEEE, 19 September 2016 (2016-09-19), pages 1 - 4, XP033030246, DOI: 10.1109/ICHVE.2016.7800923
LIU HONGJIE; TAN WEI; LI LANXIA; CHENG XINGMING; WANG ZHEN: "Study of epoxy molding compound with high dielectric constant", 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), IEEE, 16 August 2017 (2017-08-16), pages 971 - 973, XP033154346, DOI: 10.1109/ICEPT.2017.8046605
LIU HONGJIE; TAN WEI; LI LANXIA; CHENG XINGMING; WANG ZHEN: "Study of epoxy molding compound with high dielectric constant", 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), IEEE, 16 August 2017 (2017-08-16), pages 971 - 973, XP033154346, DOI: 10.1109/ICEPT.2017.8046605
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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