Title:
RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND COLOR FILTER
Document Type and Number:
WIPO Patent Application WO/2014/050633
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copolymer composition which has good sensitivity and developability, and which is capable of providing a cured coating film that has excellent thermal decomposition resistance, thermal yellowing resistance and solvent resistance.
In order to achieve the above-mentioned purpose, the present invention provides: an alkali developable resin composition that contains (A) a copolymer which is synthesized using a glycidyl (meth)acrylate, comprises no acid group, and has a weight average molecular weight of 1,000-50,000 in terms of polystyrene, and (B) a copolymer which comprises an acid group and has a weight average molecular weight of 1,000-50,000 in terms of polystyrene; and a resin composition, a photosensitive resin composition and the like, each of which contains this copolymer composition.
Inventors:
YANAGI MASAYOSHI (JP)
KINOSHITA TAKEHIRO (JP)
KAWAGUCHI YASUAKI (JP)
KINOSHITA TAKEHIRO (JP)
KAWAGUCHI YASUAKI (JP)
Application Number:
PCT/JP2013/075019
Publication Date:
April 03, 2014
Filing Date:
September 17, 2013
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/032; H01L21/027
Domestic Patent References:
WO2011136074A1 | 2011-11-03 | |||
WO2005095510A1 | 2005-10-13 |
Foreign References:
JP2008102505A | 2008-05-01 | |||
JP2004237605A | 2004-08-26 | |||
JP2004077773A | 2004-03-11 | |||
JP2012118279A | 2012-06-21 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
Michiharu Soga (JP)
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