Title:
RESIN COMPOSITION, POLISHING PAD, AND METHOD FOR PRODUCING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2019/225055
Kind Code:
A1
Abstract:
Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
Inventors:
ISHIUCHI RYUJIN (JP)
TAKAHASHI NOBUYUKI (JP)
TAKAHASHI NOBUYUKI (JP)
Application Number:
PCT/JP2019/001706
Publication Date:
November 28, 2019
Filing Date:
January 21, 2019
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F290/06; C08J5/18
Domestic Patent References:
| WO2013069441A1 | 2013-05-16 |
Foreign References:
| JP2011073085A | 2011-04-14 | |||
| JP2015193059A | 2015-11-05 | |||
| JP2006035322A | 2006-02-09 | |||
| JP2012000714A | 2012-01-05 |
Other References:
See also references of EP 3798244A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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