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Title:
RESIN COMPOSITION, PRE-PREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/061811
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a resin composition with which a cured product having high-grade flame retardancy, high heat resistance, a low rate of thermal expansion, and excellent drillability can be realized; a pre-preg comprising the resin composition; a laminate and metal foil-clad laminate comprising the pre-preg; and a printed wiring board comprising the resin composition. The resin composition containing at least: an epoxy silicone resin (A) obtained by reacting a linear polysiloxane (a) having a carboxyl group and a cyclic epoxy compound (b) having an epoxy group, so that the epoxy group of the cyclic epoxy compound (b) reaches 2-10 equiv. with respect to the carboxyl group of the linear polysiloxane (a); a cyanate ester compound (B) and/or phenolic resin (C); and an inorganic filler (D).

Inventors:
CHIBA TOMO (JP)
TAKAHASHI HIROSHI (JP)
SHIGA EISUKE (JP)
OGASHIWA TAKAAKI (JP)
Application Number:
PCT/JP2013/078388
Publication Date:
April 24, 2014
Filing Date:
October 18, 2013
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/20; B32B15/08; C08J5/24; C08K3/00; C08L63/00; H05K1/03
Domestic Patent References:
WO2011152402A12011-12-08
WO2011132674A12011-10-27
WO2012029690A12012-03-08
WO2011108524A12011-09-09
Foreign References:
JPH05295088A1993-11-09
JPH06228415A1994-08-16
JP2003252960A2003-09-10
JP2003105057A2003-04-09
JP2008266573A2008-11-06
JPH03197529A1991-08-28
JPH0366722A1991-03-22
JP3173332B22001-06-04
JPH0848001A1996-02-20
JP2000158589A2000-06-13
JP2003246849A2003-09-05
JP2006143973A2006-06-08
JP2009035728A2009-02-19
Other References:
"Sosetsu: Epokisi Jusi (Review of epoxy resin", 2003, THE JAPAN SOCIETY OF EPOXY RESIN TECHNOLOGY
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
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