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Patent Searching and Data


Title:
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLADDED LAMINATE BOARD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/054867
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition comprising: a maleimide compound (A) which has a maleimide equivalent of 500 g/eq. or less, has a solid form at 25℃, and can be dissolved at any concentration ranging from 40% by mass or more and less than 100% by mass in a mixture of at least one component selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25℃; and a polymerizable compound (B) which has a carbon-carbon unsaturated double bond in the molecule thereof, and in which the ratio of the total mass of hetero atoms to the total mass of all of constituent elements is 15% by mass or less.

Inventors:
SAITO HIROSUKE
UMEHARA HIROAKI
INOUE HIROHARU
WATANABE RIHOKO
Application Number:
PCT/JP2021/033131
Publication Date:
March 17, 2022
Filing Date:
September 09, 2021
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/02; B32B15/08; B32B27/00; C08J5/24; C08K3/013; C08K5/3415; C08L71/12; H05K1/03
Domestic Patent References:
WO2020175538A12020-09-03
WO2020004211A12020-01-02
WO2019188189A12019-10-03
WO2018159080A12018-09-07
WO2020217677A12020-10-29
Foreign References:
JP2019035036A2019-03-07
JP2020506982A2020-03-05
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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