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Patent Searching and Data


Title:
RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/210227
Kind Code:
A1
Abstract:
An aspect of the present invention is a resin composition comprising: a preliminary reaction product (A) which is obtained by reacting, in advance, a polyphenylene ether compound (a1) having a hydroxyl group in the molecule thereof and an acid anhydride (a2) having an acid anhydride group in the molecule thereof; and a curable resin (B) which contains a reactive compound having an unsaturated double bond in the molecule thereof. The equivalent ratio of the acid anhydride group of the acid anhydride (a2) to the hydroxyl group of the polyphenylene ether compound (a1) is not more than 1.5. The content of the curable resin (B) is 20-85 parts by mass with respect to 100 parts by mass of the preliminary reaction product (A) and the curable resin (B) combined.

Inventors:
NAKASHIMA TAICHI
FUJISAWA HIROYUKI
OTSUKA AKIRA
ISAJI KOICHI
OGUSHI HAJIME
Application Number:
PCT/JP2022/013786
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F283/08; B32B15/08; C08F2/44; C08J5/24; H05K1/03
Domestic Patent References:
WO2019138992A12019-07-18
Foreign References:
JPH06179734A1994-06-28
JP2017179035A2017-10-05
JPH07166049A1995-06-27
JP2021055868A2021-04-08
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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