Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/043083
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition comprising: a preliminary reaction product (A) obtained by preliminarily reacting a mixture that includes a polyphenylene ether compound (a1) and a carbodiimide compound (a2), the polyphenylene ether compound (a1) having at least one of a hydroxy group and a carboxy group within a molecule; and a reactive compound (B) having an unsaturated double bond within a molecule.
Inventors:
OGUSHI HAJIME
HIRONO HAYATE
MITO TAKATOSHI
ISAJI KOICHI
FUJISAWA HIROYUKI
HIRONO HAYATE
MITO TAKATOSHI
ISAJI KOICHI
FUJISAWA HIROYUKI
Application Number:
PCT/JP2023/028959
Publication Date:
February 29, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L71/12; B32B15/08; C08J5/24; C08K3/013; C08K5/357; C08K9/06; H05K1/03
Domestic Patent References:
| WO2022054867A1 | 2022-03-17 |
Foreign References:
| JPS63315A | 1988-01-05 | |||
| JPH0586291A | 1993-04-06 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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