Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/043084
Kind Code:
A1
Abstract:
An aspect of the present invention relates to a resin composition comprising: a polyphenylene ether compound (A); a reactive compound (B) having an unsaturated double bond in the molecule; and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having, in the molecule, a phenolic hydroxyl group and at least one among an amino group and a triazole structure; a phosphite-based antioxidant (C2) having, in the molecule, a tert-butyl group and a phosphite structure; and a hindered phenol-based antioxidant (C3) having, in the molecule, a tert-butyl group and a phenolic hydroxyl group.
More Like This:
| JP5611197 | Poly (Allylene Ether) -Polysiloxane Compositions and Methods |
| JPH0243234 | THERMOPLASTIC RESIN COMPOSITION |
| WO/2018/131563 | EPOXY RESIN COMPOSITION |
Inventors:
OGUSHI HAJIME
HIRONO HAYATE
MITO TAKATOSHI
ISAJI KOICHI
FUJISAWA HIROYUKI
HIRONO HAYATE
MITO TAKATOSHI
ISAJI KOICHI
FUJISAWA HIROYUKI
Application Number:
PCT/JP2023/028967
Publication Date:
February 29, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L71/12; B32B27/00; C08J5/24; C08K3/013; C08K5/13; C08K5/3415; C08K5/3477; C08K5/357; C08K5/524; C08K9/06; H05K1/03
Domestic Patent References:
| WO2020158849A1 | 2020-08-06 |
Foreign References:
| JP2003105193A | 2003-04-09 | |||
| JPH0333155A | 1991-02-13 | |||
| JP2009518463A | 2009-05-07 | |||
| JP2010118207A | 2010-05-27 | |||
| JP2012241168A | 2012-12-10 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
Download PDF: