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Title:
RESIN COMPOSITION, PREPREG, AND FILM
Document Type and Number:
WIPO Patent Application WO/2014/103759
Kind Code:
A1
Abstract:
A resin composition for a transparent substrate, which comprises an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) comprises a cyclohexane tricarboxylic acid anhydride.

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Inventors:
OSHIMA TOYOJI (JP)
YOSHIDA SHU (JP)
HORINO TAKERU (JP)
TAKAHASHI RINTARO (JP)
Application Number:
PCT/JP2013/083523
Publication Date:
July 03, 2014
Filing Date:
December 13, 2013
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G59/42; C08J5/24; G09F9/00; G09F9/30
Domestic Patent References:
WO2011019003A12011-02-17
WO2011111667A12011-09-15
Foreign References:
JP2011246531A2011-12-08
JP2008001880A2008-01-10
JP2009256694A2009-11-05
JP2006274190A2006-10-12
JP2007299739A2007-11-15
JP2012097134A2012-05-24
JP2003212927A2003-07-30
JP2009066931A2009-04-02
Other References:
See also references of EP 2940053A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
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