Title:
RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/125657
Kind Code:
A9
Abstract:
A resin composition for printed wiring boards which comprises a cyanic acid ester compound (A), a maleimide compound (B), and a benzoguanamine compound (C) having one or two aminomethyl groups and represented by the following general formula (1). (In general formula (1), R is a hydrogen atom or a substituent selected from the group consisting of C1-10 hydrocarbon groups, C1-10 alkoxyl groups, C6-10 aryloxy groups, a hydroxyl group, an amide group, and halogen atoms, and n is an integer of 1-2.)
Inventors:
KOBAYASHI TAKASHI (JP)
TAKANO KENTARO (JP)
HIRAMATSU SOTARO (JP)
TAKANO KENTARO (JP)
HIRAMATSU SOTARO (JP)
Application Number:
PCT/JP2016/052349
Publication Date:
September 29, 2016
Filing Date:
January 27, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L61/14; C08G8/28; C08J5/24; C08K5/3415; C08K5/3477; C08L61/34; H05K1/03
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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