RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE BOARD, METAL FOIL-CLAD LAMINATE BOARD, AND PRINTED WIRING BOARD

Title:

RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATE BOARD, METAL FOIL-CLAD LAMINATE BOARD, AND PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2022/249999

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide: a resin composition which is suitable for use in the production of an insulating layer of a printed wiring board, the resin composition having a high dielectric constant, a low dielectric loss tangent, excellent moisture absorption and heat resistance, a high glass transition temperature, a low thermal expansion coefficient, and good coating properties and external appearance; and a prepreg, a resin sheet, a laminate board, a metal foil-clad laminate board, and a printed wiring board, each of which is obtained using this resin composition. A resin composition according to the present invention contains a cyanate ester compound (A), a maleimide compound (B), and a surface-coated titanium oxide (C), wherein the cyanate ester compound (A) content is 1-65 parts by mass with respect to 100 parts by mass of the total resin solid content in the resin composition, and the maleimide compound (B) content is 15-85 parts by mass with respect to 100 parts by mass of the total resin solid content in the resin composition.

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Inventors:

TAKAMURA TATSURO (JP)
KASHIMA NAOKI (JP)
ITO SAYAKA (JP)
URAHAMA NARIHIRO (JP)
SUNAKAWA KAZUKI (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)

Application Number:

PCT/JP2022/021040

Publication Date:

December 01, 2022

Filing Date:

May 23, 2022

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

H05K1/03; B32B15/08; C08G73/00; C08K3/22; C08L61/06; C08L61/18

Domestic Patent References:

WO2013187303A1	2013-12-19
WO2014057933A1	2014-04-17
WO2018235821A1	2018-12-27

Foreign References:

JP2020176267A	2020-10-29
JP2013095855A	2013-05-20
JP2014139993A	2014-07-31

Attorney, Agent or Firm:

INABA, Yoshiyuki et al. (JP)

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