Title:
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED SHEET, METAL FOIL-CLAD LAMINATED SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/182122
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition having a high dielectric constant and a low dielectric loss tangent and that can be suitably used to prepare an insulating layer on a printed wiring board having excellent heat resistance properties and moisture absorption/heat resistance properties, and to provide a prepreg, resin sheet, laminated sheet, metal foil-clad laminated sheet, and printed wiring board obtained using said resin composition. The resin composition of the present invention contains: surface-coated titanium oxide (A) having a mass loss ratio of 0.5 mass% or less when heated from 30°C to 300°C at a rate of 10°C per minute; and a thermosetting compound (B).
Inventors:
ITO SAYAKA (JP)
TAKAMURA TATSURO (JP)
KASHIMA NAOKI (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)
TAKAMURA TATSURO (JP)
KASHIMA NAOKI (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)
Application Number:
PCT/JP2023/010221
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/18; C08J5/18; C08J5/24; C08K3/013; C08K3/22; C08K9/00
Domestic Patent References:
| WO2021246231A1 | 2021-12-09 |
Foreign References:
| JP2018145374A | 2018-09-20 | |||
| JP2013155344A | 2013-08-15 | |||
| JP2020122034A | 2020-08-13 | |||
| JP2012211225A | 2012-11-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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