Title:
RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/182123
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin composition which is suitable for use in the production of an insulating layer of a printed wiring board, the insulating layer having a high dielectric constant and a low dielectric loss tangent, excellent moisture absorption and heat resistance, a high glass-transition temperature, and a low thermal-expansion coefficient; and a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, and a printed wiring board, each of which is obtained using the resin composition. The resin composition according to the present invention contains a surface-coated titanium oxide (A) and a thermosetting compound (B) and has a water absorption rate as calculated by formula (i) of 0.40% or less. (i): Water absorption rate (%) = [(M2 - M1)/M1] × 100
Inventors:
TAKAMURA TATSURO (JP)
ITO SAYAKA (JP)
KASHIMA NAOKI (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)
ITO SAYAKA (JP)
KASHIMA NAOKI (JP)
MIYAHIRA TETSURO (JP)
OGASHIWA TAKAAKI (JP)
Application Number:
PCT/JP2023/010222
Publication Date:
September 28, 2023
Filing Date:
March 16, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L101/00; B32B15/08; B32B27/18; C08J5/18; C08J5/24; C08K3/013; C08K3/22; C08K9/00
Domestic Patent References:
| WO2021246231A1 | 2021-12-09 |
Foreign References:
| JP2018145374A | 2018-09-20 | |||
| JP2013155344A | 2013-08-15 | |||
| JP2020122034A | 2020-08-13 | |||
| JP2012211225A | 2012-11-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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