Title:
RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION, AND METHOD OF FORMING RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2002/088845
Kind Code:
A1
Abstract:
A resin composition which comprises a polyimide precursor and a photosensitizer, wherein the polyimide precursor has structural units represented by the following formula (1), wherein A?1¿ is a tetravalent organic group and A?2¿ is a divalent organic group having an alicyclic structure. Due to this polyimide precursor, the composition gives a film having excellent light-transmitting properties in a wide wavelength range. The polyimide precursor has been partly imidized to a degree of 7.5% to 36%. Because of this, the resin composition has low solubility in a developing solution and the unexposed areas do not dissolve in the developing solution. (1)
Inventors:
NOMURA MAMIKO (JP)
HASEGAWA MASATOSHI (JP)
ISHII JUNICHI (JP)
AKAMATSU TADASHI (JP)
HASEGAWA MASATOSHI (JP)
ISHII JUNICHI (JP)
AKAMATSU TADASHI (JP)
Application Number:
PCT/JP2002/003807
Publication Date:
November 07, 2002
Filing Date:
April 17, 2002
Export Citation:
Assignee:
SONY CHEMICALS CORP (JP)
NOMURA MAMIKO (JP)
HASEGAWA MASATOSHI (JP)
ISHII JUNICHI (JP)
AKAMATSU TADASHI (JP)
NOMURA MAMIKO (JP)
HASEGAWA MASATOSHI (JP)
ISHII JUNICHI (JP)
AKAMATSU TADASHI (JP)
International Classes:
G03F7/037; C08G73/10; C08K5/00; C08L79/08; C09D5/00; C09D179/08; G03F7/022; G03F7/023; H01L21/027; H05K3/46; (IPC1-7): G03F7/037; C08L79/08; G03F7/022; H01L21/027
Foreign References:
| EP1037112A1 | 2000-09-20 | |||
| US4942108A | 1990-07-17 | |||
| JPH11153868A | 1999-06-08 | |||
| JPH11338143A | 1999-12-10 | |||
| JPH0673003A | 1994-03-15 | |||
| JP2000330297A | 2000-11-30 |
Attorney, Agent or Firm:
Ishijima, Shigeo (2-18 Toranomon 1-chom, Minato-ku Tokyo, JP)
Download PDF:
Previous Patent: ALTERNATING PHASE SHIFT MASK
Next Patent: COMPONENT FOR A PRINTER, FAX MACHINE, COPIER OR THE LIKE
Next Patent: COMPONENT FOR A PRINTER, FAX MACHINE, COPIER OR THE LIKE