Title:
RESIN COMPOSITION AND PURGING AGENT USING SAME, AND MOLDING MACHINE PURGING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/120338
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains a hydrophilic resin (A), water (B), a basic compound (C), and a polyolefin resin (D). The content of the water (B) is 10-70 parts by mass to 100 parts by mass of the hydrophilic resin (A), the content of the basic compound (C) is 0.1-15 parts by mass to 100 parts by mass of the hydrophilic resin (A), and the polyolefin resin (D) satisfies the following formula (1): (1): 30>X×Y÷(1-Z)≥1 In formula (1), X is the MFR (g/10 min) at 190°C of the polyolefin resin (D), Y is the relaxation time (seconds) of the polyolefin resin (D) at 220°C, and Z is the density (g/cm3) of the polyolefin resin (D).
Inventors:
SUZUKI MAKOTO (JP)
Application Number:
PCT/JP2022/046107
Publication Date:
June 29, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L101/00; B29C48/27; C08L23/00; C08L29/04
Domestic Patent References:
| WO2021019873A1 | 2021-02-04 | |||
| WO2016098615A1 | 2016-06-23 | |||
| WO2022168836A1 | 2022-08-11 |
Foreign References:
| JPH1016024A | 1998-01-20 | |||
| JPH05255554A | 1993-10-05 | |||
| JP2005119039A | 2005-05-12 |
Attorney, Agent or Firm:
NAKAMICHI, Yoshihiro (JP)
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