RESIN COMPOSITION AND RADIATING SPACER FORMED FROM THE SAME

WIPO Patent Application WO/2008/032749

A1

A resin composition for use as a thermally conductive member, radiating spacer, etc. which are inexpensive and have satisfactory thermal conductivity and excellent flame retardancy; and a thermally conductive member and a radiating spacer each formed from the resin composition. The resin composition contains a thermally conductive filler in an amount of 45-60 vol.% based on the whole resin composition, the thermally conductive filler comprising an aluminum hydroxide power having a particle size distribution in which the frequency maximum is preferably at 5-70 µm. The filler more desirably contains silicon dioxide. The radiating spacer is obtained by preparing a slurry from a resin composition comprising a thermally conductive filler comprising aluminum hydroxide and a silicone resin, applying the slurry to a resin film to form a coating film, and then heating and curing it to form a sheet. The spacer has a thickness of preferably 0.3-5.0 mm and a thermal conductivity of preferably 0.8 W/m•K or higher.

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SUGINO JYUNJI (JP)
SAWA HIROAKI (JP)
SHIIBA MITSURU (JP)
TAKANO KEIJI (JP)

PCT/JP2007/067761

March 20, 2008

September 12, 2007

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DENKI KAGAKU KOGYO KK (JP)
SUGINO JYUNJI (JP)
SAWA HIROAKI (JP)
SHIIBA MITSURU (JP)
TAKANO KEIJI (JP)

H05K7/20; C09K5/08; H01L23/36

JP2002138205A	2002-05-14
JP2006182836A	2006-07-13
JP2004342758A	2004-12-02
JP2007246664A	2007-09-27

SENMYO, Kenji et al. (SIA Kanda Square 17, Kanda-konyacho, Chiyoda-k, Tokyo 35, JP)

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