Title:
RESIN COMPOSITION, SUBSTRATE-ATTACHED FILM, METAL/RESIN LAMINATED BODY AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/071153
Kind Code:
A1
Abstract:
Provided is a resin composition suitable for an insulation adhesive layer for an aluminum-based substrate. This resin composition is heat-resistant and adhesive and, once cured, has a low elasticity in a low temperature range that is 0°C or less. The resin composition includes (A) a modified elastomer having an acid anhydride group, (B) a solvent-soluble polyimide resin, and (C) an epoxy resin.
Inventors:
KOMATSU FUMIKAZU (JP)
AOKI ISSEI (JP)
TAKASUGI HIROSHI (JP)
KUSAMA MUNETOSHI (JP)
AOKI ISSEI (JP)
TAKASUGI HIROSHI (JP)
KUSAMA MUNETOSHI (JP)
Application Number:
PCT/JP2019/036961
Publication Date:
April 09, 2020
Filing Date:
September 20, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L15/00; B32B15/08; B32B27/30; B32B27/34; B32B27/38; C08K3/013; C08L53/02; C08L63/00; C08L79/08; H01L23/29; H01L23/31; H05K1/05
Domestic Patent References:
| WO2018097010A1 | 2018-05-31 |
Foreign References:
| JP2018130938A | 2018-08-23 | |||
| JP2015224304A | 2015-12-14 | |||
| JP2017210546A | 2017-11-30 | |||
| JP2018090664A | 2018-06-14 | |||
| JP2001152016A | 2001-06-05 | |||
| JP2015098504A | 2015-05-28 |
Other References:
See also references of EP 3862390A4
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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