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Title:
RESIN COMPOSITION, SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/049870
Kind Code:
A1
Abstract:
Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a crystalline polymer and a solvent dissolving the crystalline polymer. The resin composition is used to form a layer, and a haze value of the layer is 5% or more. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.

More Like This:
JPS61197657POLYMER COMPOSITION COMPOSED OF AROMATIC POLYAMIDE AND POLYPHOSPHORIC ACID AND PRODUCTION THEREOF
Inventors:
SUN LIMIN (US)
ZHANG DONG (US)
JING JIAOKAI (US)
HARRIS FRANK W (US)
UMEDA HIDEO (JP)
OKADA JUN (JP)
NAITO MANABU (JP)
Application Number:
PCT/JP2014/005036
Publication Date:
April 09, 2015
Filing Date:
October 02, 2014
Export Citation:
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Assignee:
AKRON POLYMER SYSTEMS INC (US)
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L77/00; B32B7/02; C08G59/50; C08L63/00; H01L21/336; H01L29/786; H01L51/50; H05B33/02
Domestic Patent References:
WO2004039863A12004-05-13
WO2013006452A22013-01-10
WO2012129422A22012-09-27
WO2014126210A12014-08-21
WO2014047642A12014-03-27
WO2014047640A12014-03-27
WO2014171397A12014-10-23
WO2014162845A12014-10-09
Foreign References:
US3386965A1968-06-04
JPS62176506A1987-08-03
JP2006159636A2006-06-22
JP2010502794A2010-01-28
JPH08269195A1996-10-15
US20100036085A12010-02-11
JP2009079210A2009-04-16
JP2006255918A2006-09-28
JP2013014135A2013-01-24
JP2004107525A2004-04-08
JPH05310920A1993-11-22
JP2011227369A2011-11-10
JP2014031452A2014-02-20
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (18-9 Nishi-Shinbashi 1-chome, Minato-k, Tokyo 03, JP)
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