Title:
RESIN COMPOSITION FOR THREE-DIMENSIONAL PHOTOSHAPING
Document Type and Number:
WIPO Patent Application WO/2023/026905
Kind Code:
A1
Abstract:
Provided is a resin composition for three-dimensional photoshaping that melts at a comparatively low temperature of about 200°C after curing and has exceptional shapeability. The present invention relates to a resin composition for three-dimensional photoshaping that includes a reactive material having an acetal structure and a crosslinkable double bond in each molecule.
Inventors:
WATANABE KOJI (JP)
OZOE HIROAKI (JP)
OZOE HIROAKI (JP)
Application Number:
PCT/JP2022/031000
Publication Date:
March 02, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08F20/28; B22C9/04; B29C64/124; B29C64/314; B33Y10/00; B33Y70/00; B33Y80/00
Foreign References:
| JPH05212804A | 1993-08-24 | |||
| JP2018122499A | 2018-08-09 | |||
| JP2019142081A | 2019-08-29 | |||
| JP2018048312A | 2018-03-29 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF: