Title:
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/026904
Kind Code:
A1
Abstract:
The present disclosure provides a substrate for mounting an electronic element which makes it possible to reduce the possibility of a change in the size of an element mounting surface even when positional deviation occurs during layering of a plurality of frame parts. The substrate comprises a base part, a first frame part and a second frame part. The first frame part has at least a pair of first and second protruding portions, each of which protrudes, on the element mounting part side on which the element is to be mounted, more than the second frame part. The protrusion width of the first protruding portion is larger than the protrusion width of the second protruding portion, and the distance between the first protruding portion and the element mounting part is smaller than the distance between the second protruding portion and the element mounting part.
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Inventors:
KOHAMA KENICHI (JP)
Application Number:
PCT/JP2022/030999
Publication Date:
March 02, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/03; H01L23/02; H01L23/08
Foreign References:
| JP2018137534A | 2018-08-30 | |||
| JP2018019214A | 2018-02-01 | |||
| JP2018010890A | 2018-01-18 | |||
| JPH10189810A | 1998-07-21 | |||
| JP2020136495A | 2020-08-31 | |||
| JP2018186173A | 2018-11-22 | |||
| JP2013120867A | 2013-06-17 | |||
| JP2005203485A | 2005-07-28 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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