Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/093510
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition which has superior low-temperature rapid curability, in which the Tg (glass transition point) of the cured material is low, and in which the Tg of the cured material substantially does not change even when a long period of time has elapsed after curing. This resin composition comprises (A) an epoxy resin that does not contain benzene rings, (B) a thiol compound having at least two thiol groups in the molecule, and (C) a latent curing agent. Preferably, the (B) component is admixed in a ratio of 1.0 to 2.0 in terms of the thiol equivalent ratio, relative to the epoxy equivalent of the (A) component.
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Inventors:
IWAYA KAZUKI
HOSONO YOHEI
YOKOYAMA RUKA
HOSONO YOHEI
YOKOYAMA RUKA
Application Number:
PCT/JP2011/070917
Publication Date:
July 12, 2012
Filing Date:
September 14, 2011
Export Citation:
Assignee:
NAMICS CORP (JP)
IWAYA KAZUKI
HOSONO YOHEI
YOKOYAMA RUKA
IWAYA KAZUKI
HOSONO YOHEI
YOKOYAMA RUKA
International Classes:
C08G59/22; C08G59/66; C09J11/06; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2010052823A1 | 2010-05-14 |
Foreign References:
| JPH06211969A | 1994-08-02 | |||
| JPH06211970A | 1994-08-02 | |||
| JP2008088212A | 2008-04-17 | |||
| JPS63186727A | 1988-08-02 |
Attorney, Agent or Firm:
TSUKUNI, HAJIME (JP)
Hajime Tsukuni (JP)
Hajime Tsukuni (JP)
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Claims:
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