Title:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/093509
Kind Code:
A1
Abstract:
Provided is a semiconductor device and a method of manufacturing thereof, wherein soldering defects such as solder-drawn sections or solder voids can be prevented from being produced. In a semiconductor device that has conductor-pattern installed insulation circuit boards (12) adhered to a cooling base (1) with solder (6), soldering defects such as solder-drawn sections or solder voids can be prevented from being produced, by intentionally making the cooling base (1) have a temperature gradient when solder (6) below the conductor-pattern installed insulation circuit boards (12) is cooled and solidified, and by forming a solder accumulating section (8) at a place where solidifying of melted solder (6b) below each of the conductor-pattern installed insulation circuit boards (12) is delayed the most.
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Inventors:
SUZUKI KENJI (JP)
Application Number:
PCT/JP2011/070777
Publication Date:
July 12, 2012
Filing Date:
September 13, 2011
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
SUZUKI KENJI (JP)
SUZUKI KENJI (JP)
International Classes:
H01L25/07; H01L23/36; H01L25/18
Foreign References:
| JP2005039081A | 2005-02-10 | |||
| JP2000183212A | 2000-06-30 | |||
| JP2009099882A | 2009-05-07 | |||
| JP2005203525A | 2005-07-28 | |||
| JPH1050928A | 1998-02-20 |
Attorney, Agent or Firm:
HATTORI, KIYOSHI (JP)
Kiyoshi Hattori (JP)
Kiyoshi Hattori (JP)
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Claims: