Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/203906
Kind Code:
A1
Abstract:
This resin composition comprises an epoxy resin (A) and an inorganic filler (B), wherein the epoxy resin (A) contains a liquid epoxy resin (A-1); the inorganic filler (B) contains a carbon-containing inorganic filler (B-1) having a carbon content of at least 0.2 mass%; the amount of the liquid epoxy resin (A-1) is at least 0.5 mass% with reference to 100 mass% for the nonvolatile component in the resin composition; and the amount of the carbon-containing inorganic filler (B-1) is at least 10 mass% with reference to 100 mass% for the nonvolatile component in the resin composition.
Inventors:
WATANABE MASATOSHI (JP)
NAKAMURA YOSUKE (JP)
NAKAMURA YOSUKE (JP)
Application Number:
PCT/JP2023/008794
Publication Date:
October 26, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; B32B27/38; C08G59/20; C08K3/013; C08K3/36; H01L23/14; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| WO2018181737A1 | 2018-10-04 |
Foreign References:
| JP2021070748A | 2021-05-06 | |||
| JP2016191031A | 2016-11-10 | |||
| JP2002284962A | 2002-10-03 | |||
| JP2016008280A | 2016-01-18 | |||
| US20110184092A1 | 2011-07-28 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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