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Title:
RESIN CONTAINING PHENOLIC HYDROXYL GROUP
Document Type and Number:
WIPO Patent Application WO/2022/239597
Kind Code:
A1
Abstract:
Provided is a curable material that can be formed into a thick film and has flexibility and developing properties. More specifically provided is a resin containing a phenolic hydroxyl group, the resin comprising a structural unit A represented by formula (A) and a structural unit B represented by formula (B). In formula (A), R1 represents an aliphatic hydrocarbon group, an alkoxy group, an aryl group, an aralkyl group, or a halogen atom; R2 represents a hydrogen atom, an aliphatic hydrocarbon group, an alkoxy group, an aryl group, an aralkyl group, or a halogen atom; l represents 0 or 1; and m represents 1 or 2. In formula (B), R3 represents an aliphatic hydrocarbon group having 6 to 18 carbon atoms.

Inventors:
NAGATA HIROHITO (JP)
IMADA TOMOYUKI (JP)
Application Number:
PCT/JP2022/017764
Publication Date:
November 17, 2022
Filing Date:
April 14, 2022
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
G03F7/023; C08G8/04; G03F7/11
Domestic Patent References:
WO2016185865A12016-11-24
WO2017029935A12017-02-23
WO2020153048A12020-07-30
Foreign References:
JPH03503781A1991-08-22
JP2018532027A2018-11-01
US20120264864A12012-10-18
EP0472446A21992-02-26
JP2006518004A2006-08-03
US2231860A1941-02-11
JPH01206337A1989-08-18
Attorney, Agent or Firm:
ONO Takayuki (JP)
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