Title:
RESIN-EQUIPPED FIBROUS BASE AND METHOD FOR PRODUCING MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/228486
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin-equipped fibrous base which has sufficient adhesiveness and can be inhibited from suffering fiber fraying when cut and in which the resin material shows satisfactory transferability when contacted. This resin-equipped fibrous base comprises a fibrous base and dot-shaped resin parts disposed on at least one surface of the fibrous base, wherein the resin parts include a thermoplastic resin, the ratio of the mass A2 per unit area of the resin parts to the mass A1 per unit area of the fibrous base, A2/A1, is 0.005-0.105, and the ratio of the average diameter B2 of the resin parts to the average constituent-unit width B1 of the fibrous base, B2/B1, is 0.06-0.96.
Inventors:
FUJINO NOBU (JP)
Application Number:
PCT/JP2023/004557
Publication Date:
November 30, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
NITTO BOSEKI CO LTD (JP)
International Classes:
B32B3/10; B29B11/16; B32B5/00; B32B5/24
Domestic Patent References:
| WO2003004758A1 | 2003-01-16 |
Foreign References:
| JP2006103305A | 2006-04-20 | |||
| JP2018066074A | 2018-04-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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