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Patent Searching and Data


Title:
RESIN FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/189180
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a resin film, an end of which can easily be released from a wound section in a wound-back state without tearing the resin film in the longitudinal direction. In order to achieve this objective, a resin film according to the present invention is formed from a vinylidene chloride resin composition in which the ratio (surface adhesive strength value/MD tear strength value) of the value for surface adhesive strength (unit: N) to the value for MD tear strength (unit: mN) is at least 0.35 and less than 0.41.

Inventors:
SHITSUKAWA MASANORI (JP)
HOSODA TOMONORI (JP)
ENOMOTO SEI (JP)
SEINO TAICHI (JP)
SEKI TAKAYUKI (JP)
MATSUURA YUKO (JP)
Application Number:
PCT/JP2020/007088
Publication Date:
September 24, 2020
Filing Date:
February 21, 2020
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
C08F14/08; C08J5/18
Domestic Patent References:
WO2015029594A12015-03-05
WO2016189987A12016-12-01
Foreign References:
JP2014172312A2014-09-22
JP2018024720A2018-02-15
JP2002256029A2002-09-11
JP2014234271A2014-12-15
JPH1025387A1998-01-27
JP2016023272A2016-02-08
JP2003137911A2003-05-14
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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