Title:
RESIN LAMINATE FORMATION DEVICE AND RESIN LAMINATE FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/057475
Kind Code:
A1
Abstract:
Provided is a resin laminate formation device comprising: a discharge device that discharges a cured resin in the form of a film so as to cover the upper surface of a component mounted in the interior of a cavity formed in a base, the component having a height dimension greater than the depth dimension of the cavity, and so as to cover the upper surface of the base; and a flattening device that flattens the cured resin discharged by the discharge device to a set height that is set to a position higher than the upper surface of the component in a state of being mounted in the interior of the cavity. The discharging of the cured resin by the discharge device and the flattening by the flattening device are executed repeatedly, whereby the film-form cured resin is layered and a resin laminate for which the upper-surface height is the set height is formed on the base.
Inventors:
HIRAMATSU NAOHIKO (JP)
Application Number:
PCT/JP2022/034542
Publication Date:
March 21, 2024
Filing Date:
September 15, 2022
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K3/28
Domestic Patent References:
| WO2019186780A1 | 2019-10-03 | |||
| WO2018110383A1 | 2018-06-21 |
Foreign References:
| JP2019145599A | 2019-08-29 | |||
| US20120153493A1 | 2012-06-21 |
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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