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Title:
RESIN MEMBER MACHINING METHOD, RESIN MEMBER MACHINING APPARATUS, AND RESIN COMPONENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/131642
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for machining resin members by using photoirradiation to sufficiently heat only a desired region of a resin-containing member. The present invention also addresses the problem of providing a resin member machining apparatus and a resin component manufacturing method for carrying out said machining. A resin member machining method that solves these problems includes a step for irradiating a resin-containing first member with first light of a first wavelength that electronically excites the resin, and a step for irradiating the resin, electronically excited through irradiation with the first light, with second light of a second wavelength longer than the first wavelength. The second wavelength is included in a wavelength region such that the optical absorptance of the resin is increased through electronic excitation.

Inventors:
ASAKAWA YUICHI
TSUBOI YASUYUKI
TAMEMOTO HIROAKI
TAOKA RYOTA
YAMAMOTO MINORU
Application Number:
PCT/JP2020/045504
Publication Date:
July 01, 2021
Filing Date:
December 07, 2020
Export Citation:
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Assignee:
LASER SYSTEMS INC (JP)
NICHIA CORP (JP)
International Classes:
B29C65/16
Domestic Patent References:
WO2017145269A12017-08-31
Foreign References:
DE3714504A11988-11-10
JP2012062187A2012-03-29
JP2012027447A2012-02-09
JP2019239647A2019-12-27
Other References:
"Journal of Physical Chemistry", vol. 97, 1993, AMERICAN CHEMICAL SOCIETY, pages: 6753 - 6759
"Macromolecules", vol. 27, 1994, AMERICAN CHEMICAL SOCIETY
See also references of EP 4082760A4
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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