Title:
RESIN MODIFIER, RESIN COMPOSITION, MOLDED ARTICLE, AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/202684
Kind Code:
A1
Abstract:
A resin modifier (Y) includes a block polymer (X) having, as structural units, a hydrophobic polymer (a) block and hydrophilic polymer (b) block, and a polyolefin (W) having a functional group that is reactive to a carboxylic group, wherein the block polymer (X) has a molecular structure which is any one of (1)-(3) below. (1) A straight-chain (a)-(b) diblock structure; (2) a straight-chain (b)-(a)-(b) triblock structure; (3) a branched structure in which two to three (b) blocks are attached to one end of an (a) block.
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Inventors:
TAKEMURA DAIKI (JP)
TOKUNAGA HIRONOBU (JP)
NAKABUCHI TAKASHI (JP)
TOKUNAGA HIRONOBU (JP)
NAKABUCHI TAKASHI (JP)
Application Number:
PCT/JP2022/012702
Publication Date:
September 29, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD (JP)
International Classes:
C08L23/26; C08G81/02; C08L87/00; C08L101/00
Foreign References:
| JP2005097596A | 2005-04-14 | |||
| JP2004190028A | 2004-07-08 | |||
| JP2008031460A | 2008-02-14 | |||
| JP2007291376A | 2007-11-08 | |||
| JP2021025042A | 2021-02-22 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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