Title:
THERMOSETTING COMPOSITION, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202683
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing a thermosetting composition with which it is possible to achieve a long pot life, excellent thermosetting properties, and excellent photocuring properties that enables temporary bonding. This thermosetting composition contains: (A) a resin having at least one group selected from the group consisting of an epoxy group, an oxetane group and a vinyl ether group; (B) a cationic thermal polymerization initiator; (C) a cationic photopolymerization initiator; and (D) a stabilizer. The stabilizer (D) includes at least one of a surfactant (D1), an antioxidant (D2) and a resin modifier (D3). In the stabilizer (D), if the proportion of the surfactant (D1) is taken to be X mass%, the proportion of the antioxidant (D2) is taken to be Y mass% and the proportion of the resin modifier (D3) is taken to be Z mass%, the ratio of the stabilizer (D) relative to 100 parts by mass of component (A) is (5.0×X+1.5×Y+20.0×Z)/100 parts by mass or less.
Inventors:
KOBAYASHI YUKI
WAKAIKI TAKAHIRO
WAKAIKI TAKAHIRO
Application Number:
PCT/JP2022/012694
Publication Date:
September 29, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/40; C08G65/18; C08K3/013; C08K5/10; C08K5/29; C08L63/00; C09J11/02; C09J129/10; C09J163/00; C09J171/00
Domestic Patent References:
| WO2017175735A1 | 2017-10-12 | |||
| WO2005059002A1 | 2005-06-30 | |||
| WO2021117396A1 | 2021-06-17 |
Foreign References:
| JPH07252402A | 1995-10-03 | |||
| JP2008266531A | 2008-11-06 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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