Title:
RESIN MOLDING APPARATUS, RESIN MOLDING METHOD, EJECTION MECHANISM, AND EJECTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/094293
Kind Code:
A1
Abstract:
Provided is a configuration that has a simple construction and has been downsized, and that stably ejects flowable resin. A resin molding apparatus (1) is provided with: a delivery mechanism (27) that is provided in a supply mechanism (19) and delivers a flowable resin (30); a storage section (28) that is connected to the delivery mechanism and stores the flowable resin; an ejection section (29) that is connected to the storage section and ejects the flowable resin; a rotation mechanism (31) that is provided in the delivery mechanism; a movement member (35) that advances and retreats along an inner wall of the storage section on the basis of rotation of the rotation mechanism, and that pushes the flowable resin stored in the storage section; a detection section (39) that detects a torque value applied to the rotation mechanism via the movement member as a result of resin pressure of the flowable resin inside the storage section; and a control section (22) that controls the movement speed of the movement member or the rotation speed of the rotation mechanism on the basis of the detected torque value. The control unit controls a supply amount of the flowable resin to be supplied to an accommodation section by controlling the movement member to advance, stop, and then retreat.
Inventors:
HANASAKA SHUHO (JP)
YAMADA TETSUYA (JP)
IWATA YASUHIRO (JP)
GOTOH TOMOYUKI (JP)
YAMADA TETSUYA (JP)
IWATA YASUHIRO (JP)
GOTOH TOMOYUKI (JP)
Application Number:
PCT/JP2016/074208
Publication Date:
June 08, 2017
Filing Date:
August 19, 2016
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C43/34; B29C31/04; B29C43/18; B29C43/58; B29C45/02; B29C45/77; H01L21/56
Foreign References:
| JP2015211121A | 2015-11-24 | |||
| JPH03247433A | 1991-11-05 | |||
| JP2008114428A | 2008-05-22 | |||
| JP2013153057A | 2013-08-08 | |||
| JP2015193096A | 2015-11-05 | |||
| JP2010064457A | 2010-03-25 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: