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Patent Searching and Data


Title:
RESIN MOLDING AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/071434
Kind Code:
A1
Abstract:
A resin molding obtained from a resin composition containing polypropylene resin and cellulose fibers, the polypropylene resin including an acid-modified polypropylene resin as a portion thereof, wherein, in wide-angle X-ray diffraction measurement of the resin molding, a diffraction peak originating from the (040) planes of α crystals of polypropylene is observed where the scattering vector s is 1.92±0.1 nm-1, a diffraction peak originating from the (300) planes of β crystals of polypropylene is observed where the scattering vector s is 1.83±0.1 nm-1, and a diffraction peak originating from the (004) planes of Iβ-type crystals of cellulose is observed where the scattering vector s is 3.86±0.1 nm-1, and the degree of orientation of the cellulose fibers in the resin molding is greater than 0.1 and less than 0.8.

Inventors:
IKURA YUKIHIRO (JP)
ITO SUZUNE (JP)
NAKAJIMA YASUO (JP)
SUYAMA KENICHI (JP)
KIM JAE KYUNG (JP)
TANAKA HIROKI (JP)
TOMOMATSU ISAO (JP)
Application Number:
PCT/JP2019/038950
Publication Date:
April 09, 2020
Filing Date:
October 02, 2019
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C08L23/10; C08L1/02; C08L23/26
Foreign References:
JP2017226754A2017-12-28
JP2017210595A2017-11-30
JPS57115437A1982-07-17
JPH08283475A1996-10-29
JP2009167249A2009-07-30
JP2011523430A2011-08-11
JP2016094541A2016-05-26
JP2016160267A2016-09-05
JP5762674B22015-08-12
JP2018188394A2018-11-29
Other References:
See also references of EP 3862393A4
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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