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Patent Searching and Data


Title:
RESIN MOLDING DEVICE, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/018760
Kind Code:
A1
Abstract:
In the present invention, a transport mechanism 19, which reliably recovers unnecessary resin on a pot block that has an overhanging part while reliably transporting a resin molded article from a lower mold provided with the pot block, has: a first holding part 20 that holds the resin molded article W2; a second holding part 21 that holds the unnecessary resin K on the pot block 141; a first lifting mechanism 22 that raises the first holding part 20 so that the resin molded article W2 held by the first holding part 20 moves upward underneath the overhanging part 141b; and a horizontal moving mechanism 23 that, in a state in which the first holding part 20 is raised by the first lifting mechanism 22, moves the first holding part 20 horizontally so that the resin molded article W2 held by the first holding part 20 moves out from underneath the overhanging part 141b. In a state in which the resin molded article W2 is moved out from underneath the overhanging part 141b and the second holding part 21 is in contact with the unnecessary resin K on the pot block 141, the lower mold 15 is lowered by a mold clamping mechanism 17, and a plunger 142a is raised relative to the lower mold by a transfer mechanism 142.

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Inventors:
YOSHIDA SHUHEI (JP)
OKUNISHI YOSHITO (JP)
OGAWA FUYUHIKO (JP)
Application Number:
PCT/JP2023/020369
Publication Date:
January 25, 2024
Filing Date:
May 31, 2023
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C33/44; B29C45/02; H01L21/56
Foreign References:
JP6655150B12020-02-26
JP2022039811A2022-03-10
JP2020026088A2020-02-20
JP2015079864A2015-04-23
Attorney, Agent or Firm:
NISHIMURA, Ryuhei et al. (JP)
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