Title:
RESIN MULTI-LAYER SUBSTRATE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/156422
Kind Code:
A1
Abstract:
The present invention is characterized in that a flat cable (101) is provided with: tri-plate lines (106A, 106C) that have a plurality of resin layers (11-15) having flexibility laminated together, are provided with a line conductor (23A) and grounding conductors (21A, 25A, 25B), and are configured in a manner such that one of the grounding conductors (21A, 25A, 25B) is opposing at each of the two surfaces of the line conductor (23A); and a microstrip line (106B) configured in a manner so that one of the grounding conductors (21A, 25A, 25B) is opposing at only one surface of the line conductor (23A). The present invention is further characterized in that the width of the line conductor (23A) in the microstrip line (106B) is wider than the width of the line conductor (23A) in the tri-plate lines (106A, 106C), and the microstrip line (106B) is bent at the position at which the microstrip line (106B) is provided.
Inventors:
BABA TAKAHIRO (JP)
IKEMOTO NOBUO (JP)
IKEMOTO NOBUO (JP)
Application Number:
PCT/JP2014/054409
Publication Date:
October 02, 2014
Filing Date:
February 25, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01L25/10; H01L25/18; H01P3/08; H05K3/46
Foreign References:
| JPH09260905A | 1997-10-03 | |||
| JPH0515508U | 1993-02-26 | |||
| JPH05283914A | 1993-10-29 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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