Title:
RESIN PLATE PRINTING/MOLDING SYSTEM AND RESIN PLATE PRINTING/MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/013554
Kind Code:
A1
Abstract:
A resin plate printing and molding system enables anyone to quickly, efficiently, and simply printing a desired image on a resin plate without any special technical knowledge, and efficiently producing a molded piece, for example, a fake nail on which a desired color and pattern is given. The printing/molding system comprises a molding control computer (1) which performs general image processings such as enlargement/reduction, distortion correction, and trimming of an image recorded in a recording medium (18) of a portable telephone (17) with a camera or an image created on a personal computer (19) and creates a desired molding image, a printing/molding device (3) which prints a molding image on a resin plate and molds the printed resin plate into a molded piece of a desired shape under the control of the molding control computer (1), and a database (2) which stores and manages the molding images under the control of the molding control computer (1).
More Like This:
Inventors:
SEKI MASAHIRO (JP)
Application Number:
PCT/JP2006/314881
Publication Date:
February 01, 2007
Filing Date:
July 27, 2006
Export Citation:
Assignee:
SE PLANNING CO LTD (JP)
SEKI MASAHIRO (JP)
SEKI MASAHIRO (JP)
International Classes:
B29C33/00; B29C51/26; B41J3/407; G06F3/12; G06Q50/00; B29L31/48
Foreign References:
JP2004344628A | 2004-12-09 | |||
JP2002172018A | 2002-06-18 | |||
JP2001197924A | 2001-07-24 | |||
JP2004303249A | 2004-10-28 | |||
JP2001306677A | 2001-11-02 | |||
JPH03159714A | 1991-07-09 | |||
JP3118991U | 2006-02-16 |
Attorney, Agent or Firm:
SHIMOYAMA, Fujio (Shuwa building-1026 1-7, Akasaka 9-chom, Minato-ku Tokyo 52, JP)
Download PDF: