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Title:
RESIN SEALING COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND DEVICE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2010/038660
Kind Code:
A1
Abstract:
A top force (6) and a bottom force (10) of a resin sealing compression molding device are equipped, respectively, with cooling means (64, 104).  A gate nozzle (15) equipped with a cooling means (154a) is provided in the top force (6).  The bottom force (10) is provided with a cavity (106) in which a single sheet of substrate is loaded.  In this device, a predetermined quantity of liquid thermosetting resin material (R) is supplied into the cavity (106) through the gate nozzle (15).  Thereafter, a substrate is supplied to between the top force (6) and bottom force (10), and the top force (6) and bottom force (10) are clamped.  Consequently, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106).  In other words, compression resin molding is carried out.  At this time, the temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).

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Inventors:
BANDOH KAZUHIKO (JP)
MAEDA KEIJI (JP)
FUJIWARA KUNIHIKO (JP)
NAKANO NORITOSHI (JP)
Application Number:
PCT/JP2009/066606
Publication Date:
April 08, 2010
Filing Date:
September 25, 2009
Export Citation:
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Assignee:
TOWA CORP (JP)
BANDOH KAZUHIKO (JP)
MAEDA KEIJI (JP)
FUJIWARA KUNIHIKO (JP)
NAKANO NORITOSHI (JP)
International Classes:
H01L21/56; B29C43/18; B29C43/34; B29C43/36; B29C48/06; B29C48/08
Foreign References:
JP2007307766A2007-11-29
JP2007220969A2007-08-30
JP2006351970A2006-12-28
JPH03157158A1991-07-05
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (JP)
Hisao Fukami (JP)
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