Title:
RESIN SEALING DEVICE AND RESIN SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/233696
Kind Code:
A1
Abstract:
A resin sealing device seals, with a resin, an electronic component of a workpiece including a base material and the electronic component. This resin sealing device comprises: a resin sealing mold which seals, with a resin, an electronic component by molding a resin material with respect to a workpiece; a conveyance line for conveying the workpiece to the resin sealing mold; a workpiece accommodation part which can accommodate at least one workpiece; a workpiece support part which is provided between the workpiece accommodation part and the conveyance line and supports the workpiece; a pickup device which holds the workpiece supplied onto the workpiece support part from the workpiece accommodation part, and conveys the workpiece to the conveyance line; and a measurement part which is provided to at least one among the workpiece accommodation part, the workpiece support part, and the pickup device, and measures the weight of the workpiece.
Inventors:
TAGAMI SHUSAKU (JP)
YANAGISAWA MAKOTO (JP)
YANAGISAWA MAKOTO (JP)
Application Number:
PCT/JP2023/000537
Publication Date:
December 07, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
H01L21/56; H01L21/677
Domestic Patent References:
| WO2013069496A1 | 2013-05-16 |
Foreign References:
| JP2012114285A | 2012-06-14 | |||
| JP2003165133A | 2003-06-10 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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