RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

Title:

RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

Document Type and Number:

WIPO Patent Application WO/2023/062769

Kind Code:

A1

Abstract:

Provided is a resin sheet which contains a resin component (A) and an inorganic filler (B). The component (A) contains (A1) an elastomer having a number average molecular weight of 10,000 or more. The content of the component (A1) is 30 mass% or more relative to the component (A). The content of the component (B) is 40-95 vol% relative to the total amount of the resin sheet.

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Inventors:

SERA YUSUKE (JP)
ABE SHINICHIRO (JP)
HASEGAWA YASUHARU (JP)
KOTAKE TOMOHIKO (JP)
FUJIMOTO DAISUKE (JP)

Application Number:

PCT/JP2021/038025

Publication Date:

April 20, 2023

Filing Date:

October 14, 2021

Export Citation:

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Assignee:

RESONAC CORP (JP)

International Classes:

C08L101/00; B32B27/30; C08J5/18; H05K1/03

Domestic Patent References:

WO2020049964A1

2020-03-12

Foreign References:

JP2017171890A	2017-09-28
JP2015034195A	2015-02-19
JP2018135506A	2018-08-30

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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