Title:
RESIN SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/208401
Kind Code:
A1
Abstract:
This resin substrate (10) is provided with an insulating base (5) in which a plurality of conductive particles (7) are mixed with a resin (6), and a plurality of conductor patterns (8) provided on a main surface of the insulating base (5). When a gap size at a position where a gap is smallest between two conductor patterns (8) adjacent to, but not in direct conduction with, each other on the same main surface of the insulating base (5) is represented as (L1), and a gap size at a position where a gap is smallest between two conductor patterns (8) adjacent to, but not in direct conduction with, each other on different main surfaces of the insulating base (5) is represented as (L2), (L1) is greater than or equal to (L2) (L1 ≥ L2).
Inventors:
YOSUI KUNIAKI (JP)
Application Number:
PCT/JP2016/067162
Publication Date:
December 29, 2016
Filing Date:
June 09, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K1/03; H05K3/46
Foreign References:
| JP2009016504A | 2009-01-22 | |||
| JPH07335440A | 1995-12-22 | |||
| JP2001015874A | 2001-01-19 | |||
| JPS62291195A | 1987-12-17 | |||
| JP2004079629A | 2004-03-11 | |||
| JPH05218663A | 1993-08-27 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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