Title:
RESONANT DEVICE AND RESONANT DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/171025
Kind Code:
A1
Abstract:
A resonant device (1) comprising: a first substrate (50) that includes a first silicon substrate (20) and a resonator (10); a second substrate (30) that is disposed on the side of the first substrate (50) on which the resonator (10) is provided; and a connection part (60) for connecting the first substrate (50) and the second substrate (30) so as to seal the vibration space of the resonator (10). The resonator (10) has a silicon film (F2) provided on the surface thereof that is on the side facing the first silicon substrate (20), and the silicon film (F2) is directly bonded to the first silicon substrate (20) in an entire peripheral region surrounding the vibration space in a plan view of the first substrate.
Inventors:
FUKUMITSU MASAKAZU (JP)
Application Number:
PCT/JP2022/040171
Publication Date:
September 14, 2023
Filing Date:
October 27, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B81B3/00; H03H9/24; B81C1/00; H03H3/007
Foreign References:
| US20200079646A1 | 2020-03-12 | |||
| JP2018179695A | 2018-11-15 | |||
| JP2008263166A | 2008-10-30 | |||
| JP2020036063A | 2020-03-05 | |||
| JP2015145037A | 2015-08-13 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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