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Title:
RESONATING DEVICE, ASSEMBLY BOARD, AND METHOD FOR MANUFACTURING RESONATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/168364
Kind Code:
A1
Abstract:
A resonating device (1) is provided with a first board (50) including a resonator (10), and a second board (30) joined to the first board (50), wherein: the second board (30) includes a first power source terminal (ST2) electrically connected to a portion of an upper electrode (125) of the resonator (10), and a ground terminal (GT) electrically connected to a lower electrode (129) of the resonator (10); and the first board (50) includes first internal wires (LW21, LW22) electrically connecting the upper electrode (125) and the first power source terminal (ST2), and first linking wires (LL21, LL22) which are connected to the first internal wires (LW21, LW22) and end portions of which are positioned on an outer edge of the first board (50).

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Inventors:
HIGUCHI YOSHIYUKI (JP)
FUKUMITSU MASAKAZU (JP)
Application Number:
PCT/JP2021/035314
Publication Date:
August 11, 2022
Filing Date:
September 27, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H3/007; H03H9/24
Domestic Patent References:
WO2016159018A12016-10-06
Foreign References:
JP2006186566A2006-07-13
JP2016152476A2016-08-22
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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