Title:
REVERSIBLE-MULTIPLE FOOTPRINT PACKAGE AND METHOD OF MANUFACTURING
Document Type and Number:
WIPO Patent Application WO2007027790
Kind Code:
B1
Abstract:
The lead frame (10) has drain leads (7) with first ends proximate one edge of the die pad and second ends distal from the die pad. A gate lead is proximate an opposite edge of the die pad and extends away from it. Source leads (6) are integral with the die pad and extend away from the same edge as the gate lead. After encapsulation the universal drain clip (30) is attached to the drain of the die and selectively attached to the distal ends of the drain leads. For landed grid footprints and ball grid footprints, the universal clip provides a drain contact on the same exterior surface as the source and gate contacts. For an MLP footprint, the universal drain is connected to the distal ends of the drain leads to carry the drain contact to the opposite external surface.
More Like This:
Inventors:
NOQUIL JONATHAN A (PH)
Application Number:
PCT/US2006/033887
Publication Date:
June 21, 2007
Filing Date:
August 30, 2006
Export Citation:
Assignee:
FAIRCHILD SEMICONDUCTOR (US)
NOQUIL JONATHAN A (PH)
NOQUIL JONATHAN A (PH)
International Classes:
H01L23/495
Download PDF:
Previous Patent: ROSE PRUNING AND STRIPPING DEVICE
Next Patent: SYSTEM AND METHOD FOR LOCKING AND UNLOCKING A FINANCIAL ACCOUNT CARD
Next Patent: SYSTEM AND METHOD FOR LOCKING AND UNLOCKING A FINANCIAL ACCOUNT CARD