Title:
RF TAG
Document Type and Number:
WIPO Patent Application WO/2014/002437
Kind Code:
A1
Abstract:
The present invention is provided with: an inlay (10) provided with an IC chip (11) and an antenna (12); a planar auxiliary antenna (20) layered in an insulated state with the inlay (10); and a substrate (50) on which the inlay (10) and the auxiliary antenna (20) are layered. The present invention is configured so that the auxiliary antenna (20) is formed into a rectangular planar shape having long sides measuring substantially one-quarter of the wavelength of the radio wave frequency of the inlay (10), and the auxiliary antenna (20) has a cutout part (21) dividing one long side thereof into two halves, each of the halves having a length substantially equal to one-eighth of the wavelength of the radio wave frequency of the inlay (10), the cutout part (21) being formed into a recessed shape opening onto the edge of the one long side and having a predetermined width and depth allowing for the placement of the IC chip (11) of the inlay (10).
Inventors:
AKAMATSU SHINYA (JP)
SHIMIZU HIRONAGA (JP)
KIKUCHI TAKAYUKI (JP)
SHIMIZU HIRONAGA (JP)
KIKUCHI TAKAYUKI (JP)
Application Number:
PCT/JP2013/003832
Publication Date:
January 03, 2014
Filing Date:
June 20, 2013
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
H01Q1/38; G06K19/07; G06K19/077; H01Q1/40
Domestic Patent References:
| WO2010038813A1 | 2010-04-08 |
Foreign References:
| JP2003256798A | 2003-09-12 | |||
| JP2001111328A | 2001-04-20 | |||
| JP2010062941A | 2010-03-18 | |||
| JP2009081689A | 2009-04-16 | |||
| JP2010062941A | 2010-03-18 |
Other References:
See also references of EP 2866298A4
Attorney, Agent or Firm:
WATANABE, Kihei et al. (JP)
Kihei Watanabe (JP)
Kihei Watanabe (JP)
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