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Title:
RFIC CHIP-EQUIPPED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/004439
Kind Code:
A1
Abstract:
An RFIC chip-equipped product which is equipped with a product (100) having a metal surface, a coil conductor (4) having a loop surface that faces the metal surface, and an RFIC chip (1) having first and second input/output terminals which are respectively connected to one end and the other end of the coil conductor, wherein an intermediate point along the coil conductor is DC-connected to a point near the edge of the metal surface, and a magnetic flux passage section through which magnetic flux from the coil conductor passes is positioned in a region which overlaps the loop surface of the coil conductor when seen in a planar view.

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Inventors:
KATO NOBORU (JP)
MIURA TEPPEI (JP)
Application Number:
PCT/JP2018/024848
Publication Date:
January 03, 2019
Filing Date:
June 29, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/077; H01Q1/44; H01Q7/00
Domestic Patent References:
WO2012014939A12012-02-02
WO2018079718A12018-05-03
Foreign References:
JP2015211421A2015-11-24
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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