Title:
RFIC MODULE AND RFID TAG
Document Type and Number:
WIPO Patent Application WO/2021/131148
Kind Code:
A1
Abstract:
An RFIC module (101) comprises: a substrate (1) having a first surface (S1) and a second surface (S2) facing each other; an RFIC (2) mounted on the first surface (S1) side of the substrate (1); a first conductor pattern formed on the first surface (S1) of the substrate (1); a first insulator film (61) formed by printing on the first surface (S1) of the substrate (1) and a surface of the first conductor pattern; a second conductor pattern formed by printing on the first insulator film (61) and the first conductor pattern; and a second insulator film (62) covering the surface side, relative to the first surface (S1), of the substrate (1). The first conductor pattern and the second conductor pattern form a circuit that is connected between RFIC side electrodes (11, 12) to which the RFIC (2) is connected and antenna side electrodes (21, 22) facing an antenna conductor pattern.
Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2020/031304
Publication Date:
July 01, 2021
Filing Date:
August 19, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/077
Domestic Patent References:
| WO2008126458A1 | 2008-10-23 |
Foreign References:
| JP2009266134A | 2009-11-12 | |||
| JPH10193851A | 1998-07-28 | |||
| JP2007073611A | 2007-03-22 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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