Title:
RFID MODULE
Document Type and Number:
WIPO Patent Application WO/2024/048715
Kind Code:
A1
Abstract:
This RFID module comprises: a board that has a first main surface and a second main surface opposed to each other; an RFIC chip that is disposed on the first main surface of the board; a coil conductor that is disposed on the first main surface of the board; and a first conductor pattern inside the board. The coil conductor includes: a plurality of coil elements including pairs of legs and a bridge portion connecting one ends of the pairs of legs, the coil elements being arranged in a line while straddling across a predetermined winding axis; and a second conductor pattern that is disposed on the first main surface and is connected to the coil elements, thereby forming a coil shape. One end of the RFIC chip is connected to one end of the coil conductor. The first conductor pattern is connected between the other end of the RFIC chip and the other end of the coil conductor. The first conductor pattern includes a folded-back portion in which the direction of extension of the pattern is folded back.
Inventors:
MATSUMOTO KENGO (JP)
Application Number:
PCT/JP2023/031799
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/07; G06K19/077; H01F5/00; H01F17/00; H01L25/00; H01Q7/00; H05K3/46
Domestic Patent References:
| WO2013161608A1 | 2013-10-31 | |||
| WO2021059565A1 | 2021-04-01 | |||
| WO2013168558A1 | 2013-11-14 | |||
| WO2000021030A1 | 2000-04-13 |
Foreign References:
| JP2009020835A | 2009-01-29 | |||
| JP2009025855A | 2009-02-05 | |||
| JP2015130607A | 2015-07-16 | |||
| US20170344873A1 | 2017-11-30 | |||
| US20110316693A1 | 2011-12-29 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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