RIGID-FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2012/147484

A1

The present invention involves a rigid-flexible substrate provided with a plurality of rigid sections and a flexible section connecting the plurality of rigid sections, and is characterized in that: the flexible section comprises part of a first resin sheet containing at least one layer of a thermoplastic resin sheet; the rigid sections comprise parts of the first resin sheet other than the flexible section, and a second resin sheet containing a multilayered thermoplastic resin sheet, which is laminated on one surface or both surfaces of the parts of the first resin sheet other than the flexible section; tapered sections are formed at the edges on the flexible section side of the second resin sheet, and the thickness in the lamination direction of the second resin sheet in the tapered sections decreases toward the flexible section, and is effectively 0 where the tapered sections are in contact with the flexible section.

JPH06297634	COPPER-CLAD LAMINATED PLATE AND MULTI-LAYERED COPPER-CLAD LAMINATED PLATE
JPH0316297	MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
JPH05304367	MANUFACTURE OF MULTILAYER WIRING BOARD

OTSUBO YOSHIHITO (JP)
YOSHIKAWA TAKAYOSHI (JP)
TAKEZAWA AKINORI (JP)

PCT/JP2012/059321

November 01, 2012

April 05, 2012

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MURATA MANUFACTURING CO (JP)
OTSUBO YOSHIHITO (JP)
YOSHIKAWA TAKAYOSHI (JP)
TAKEZAWA AKINORI (JP)

H05K3/46; H05K1/02

JPH08139454A	1996-05-31
JP2002158445A	2002-05-31

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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